Patent №
US 7,813,541
Granted
2010-10-12
Filed 2005
Owner
NEGEVTECH LTD.
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11069712
A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
AI classification
Ownership
NEGEVTECH LTD.
assignment · 163480089
Assignors
SALI, EREZ, WAGNER, MARK, DORPHAN, YUVAL, YANIR, TOMER, DOTAN, NOAM, ZASLAVSKY, RAN
On an employer assignment, the assignors are typically the inventors.