Patent №
US 7,930,664
Granted
2011-04-19
Filed 2010
Owner
ULTRATECH, INC.
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
12885727
Through silicon vias (TSVs) in silicon chips are both programmable and non-programmable. The programmable TSVs may employ metal/insulator/metal structures to switch from an open to shorted condition with programming carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
AI hardwareH01L 23/5252H10W 20/491H01L 21/76898H01L 25/0657H01L 25/50H10W 20/023H10W 90/00H01L 2224/05124+22 more
AI classification
AI hardware0.97
Machine learning0.02
Natural language0.00
Evolutionary computation0.00
Knowledge representation0.00
Vision0.00
Speech0.00
Planning0.00
Ownership
ULTRATECH, INC.
assignment · 288670216
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