SUBSTRATE PROCESSING SYSTEM, CONTROL METHOD FOR SUBSTRATE PROCESSING APPARATUS AND PROGRAM STORED ON MEDIUM
Patent №
US 7,953,512
Granted
2011-05-31
Filed 2008
Owner
TOKYO ELECTRON LIMITED
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
12230788
The present invention provides a substrate processing system, a control method for a substrate processing apparatus, and a program for the system and/or method, each of which is intended to achieve effective control for a film-forming amount on processed substrates. The substrate processing system includes a substrate processing unit adapted for forming a film on each of the plurality of substrates; a pattern obtaining unit adapted for obtaining information about an arrangement pattern concerning arrangement of unprocessed substrates and processed substrates among the plurality of substrates; and a memory unit adapted for storing therein an arrangement/film-forming-amount model indicative of influence exerted on the film-forming amount on the substrates by the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates. A calculation unit calculates an estimated film-forming amount on the substrates, in the case of the arrangement pattern, based on the arrangement/film-forming-amount model. Then, a determination unit determines whether or not the estimated film-forming amount calculated by the calculation unit is within a predetermined range. If the estimated film-forming amount calculated by the calculation unit is determined to be within the predetermined range, a control unit will control and drive the substrate processing unit to process the substrates.
AI classification
Ownership
TOKYO ELECTRON LIMITED
assignment · 215320973
Assignors
TAKENAGA, YUICHI, YAMAGUCHI, TATSUYA, WANG, WENLING, TAKAHASHI, TOSHIHIKO, YONEZAWA, MASATO
On an employer assignment, the assignors are typically the inventors.