Patent №
US 7,953,586
Granted
—
Owner
—
Lab
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AI components
2
planning · hardware
Assignment
None on record
Dataset
AIPD
2023_r1 edition
Application
11780750
A method and system for designing bottom hole assembly configuration. The system and method include modeling the bottom hole assembly by dividing complicated BHA configurations into independent modules and segments. Modules are bounded by two stabilizers where segments are bounded by bottom hole assembly components. A recursive process is used to derive solutions for each of the segments and modules. Only two unknowns (and two non-linear equations) are left when the recursive process reaches to the bit. The two unknowns are then solved by iteration.