METHOD AND SYSTEM FOR WAFER TOPOGRAPHY-AWARE INTEGRATED CIRCUIT DESIGN ANALYSIS AND OPTIMIZATION
Patent №
US 8,024,675
Granted
2011-09-20
Filed 2006
Owner
BLAZE DFM
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11499070
A method and system for designing an optimized specification of an integrated circuit (IC) is provided. The IC comprises a plurality of cells, and each of the cells comprises a plurality of transistors. The method includes preparing a linewidth map of at least one device of the plurality of devices, performing a topography-aware analysis of the at least one device based on the linewidth map, and designing the optimized specification of the IC based on the topography-aware analysis. In another embodiment, a method for estimating a leakage power of at least one device in an IC is provided. The method includes determining a defocus and a pitch value, determining a linewidth value based on the defocus and pitch value, and estimating the leakage current and/or leakage power based on the linewidth value.
AI classification
Ownership
BLAZE DFM
assignment · 181580066
Assignors
GUPTA, PUNEET, KAHNG, ANDREW, SHARMA, PUNEET, MUDDU, SWAMY
On an employer assignment, the assignors are typically the inventors.