METHOD AND SYSTEM FOR WAFER TOPOGRAPHY-AWARE INTEGRATED CIRCUIT DESIGN ANALYSIS AND OPTIMIZATION

Patent №

US 8,024,675

Granted

2011-09-20

Filed 2006

Owner

BLAZE DFM

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11499070

A method and system for designing an optimized specification of an integrated circuit (IC) is provided. The IC comprises a plurality of cells, and each of the cells comprises a plurality of transistors. The method includes preparing a linewidth map of at least one device of the plurality of devices, performing a topography-aware analysis of the at least one device based on the linewidth map, and designing the optimized specification of the IC based on the topography-aware analysis. In another embodiment, a method for estimating a leakage power of at least one device in an IC is provided. The method includes determining a defocus and a pitch value, determining a linewidth value based on the defocus and pitch value, and estimating the leakage current and/or leakage power based on the linewidth value.

VisionG06F 30/39G06F 2119/18Y02P 90/02

AI classification

Vision0.69
Evolutionary computation0.49
AI hardware0.26
Machine learning0.00
Planning0.00
Natural language0.00
Knowledge representation0.00
Speech0.00

Ownership

BLAZE DFM

assignment · 181580066

Assignors

GUPTA, PUNEET, KAHNG, ANDREW, SHARMA, PUNEET, MUDDU, SWAMY

On an employer assignment, the assignors are typically the inventors.

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