Patent №
US 8,028,261
Granted
2011-09-27
Filed 2008
Owner
DONGBU HITEK CO., LTD.
+1 more
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
12344383
A method of predicting a substrate current in a high voltage device that may accurately predict substrate current components in each of a first region, a second region, and a third region. This may be accomplished by modeling a substrate current component in a third region, in which an inconsistency may occur when a substrate current in a high voltage device is calculated, for example using BSIM3-based modeling. According to embodiments, a substrate current for a third region may be modeled by an expression with a ternary operator, and the modeled substrate current may be added to a substrate current obtained through BSIM3-based modeling.
AI classification
Ownership
DONGBU HITEK CO., LTD.
assignment · 226330496
INPHI CORPORATION
assignment · 412620699
Assignors
KWAK, SANG-HUN
On an employer assignment, the assignors are typically the inventors.