METHOD FOR OPTICAL INSPECTION, DETECTION AND VISUALIZATION OF DEFECTS ON DISK-SHAPED OBJECTS
Patent №
US 8,090,185
Granted
2012-01-03
Filed 2008
Owner
VISTEC SEMICONDUCTOR SYSTEMS GMBH
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
12316601
A method for optical inspection, detection and visualization of defects (9) on wafers (2) is disclosed, wherein at least one camera (5) acquires images of at least one portion (11) of the wafer (2) relative to a reference point (12) of the wafer (2), and the Cartesian coordinates of the image data associated with the at least one portion (11) of the wafer (2) are transformed into polar coordinates.
AI classification
Vision1.00
Evolutionary computation0.01
Natural language0.00
Machine learning0.00
Speech0.00
Knowledge representation0.00
AI hardware0.00
Planning0.00
Ownership
VISTEC SEMICONDUCTOR SYSTEMS GMBH
assignment · 220360712
Assignors
FRIEDRICH, RALF, SKIERA, DANIEL
On an employer assignment, the assignors are typically the inventors.
From the same owner
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