CHIP-SPACER INTEGRATED RADIO FREQUENCY ID TAGS, METHODS OF MAKING SAME, AND SYSTEMS CONTAINING SAME
Patent №
US 8,317,107
Granted
2012-11-27
Filed 2005
Owner
INTEL CORPORATION
Lab
—
AI components
1
ml
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11323903
A chip package includes a radio-frequency identification (RFID) tag disposed as a spacer structure on a surface of a die in a chip package. A method includes assembling an RFID spacer structure, to at least one chip such as memory or logic. A computing system includes an RFID spacer structure in a chip package.
Machine learningG06K 19/07749G06K 19/041H01L 23/5388H01L 25/0657H10W 70/611H10W 70/699H10W 90/00H01L 2224/48091+9 more
AI classification
Machine learning0.57
Planning0.46
AI hardware0.02
Speech0.01
Vision0.00
Evolutionary computation0.00
Natural language0.00
Knowledge representation0.00
Ownership
INTEL CORPORATION
assignment · 174410003
Assignors
BUOT, JOAN REY V., ORIAS, CHRISTIAN
On an employer assignment, the assignors are typically the inventors.
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