METHOD AND APPARATUS FOR INTERFACING MULTIPLE DIES WITH MAPPING FOR SOURCE IDENTIFIER ALLOCATION
Patent №
US 8,347,258
Granted
2013-01-01
Filed 2011
Owner
STMICROELECTRONICS (GRENOBLE 2) SAS
+1 more
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
13028250
A package includes a die and at least one further die. The die has an interface configured to receive a transaction request from the further die via an interconnect and to transmit a response to the transaction request to said further die via the interconnect. The die also has mapping circuitry which is configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. This ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.
AI classification
Ownership
STMICROELECTRONICS (GRENOBLE 2) SAS
assignment · 263050510
STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
assignment · 263050510
Assignors
URZI, IGNAZIO ANTONINO, D'AUDIGIER, PHILIPPE, SAUVAGE, OLIVIER, RYAN, STUART, JONES, ANDREW MICHAEL
On an employer assignment, the assignors are typically the inventors.