TEMPERATURE CONTROL METHOD, METHOD OF OBTAINING A TEMPERATURE CORRECTION VALUE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SUBSTRATE TREATMENT APPARATUS

Patent №

US 8,380,360

Granted

2013-02-19

Filed 2008

Owner

HITACHI KOKUSAI ELECTRIC INC.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

12232007

In a temperature control method in which a target temperature is given in a thermal treatment furnace and plural heaters are controlled according to the target temperature, the correlation of the each heater and plural profile temperature sensors provided in the thermal treatment furnace is determined, a virtual temperature is calculated on the basis of the detection temperature of each profile temperature sensor and a weighting factor calculated from the correlation, and the each heater is controlled so that the virtual temperature is coincident with the target temperature.

AI hardwareH01L 21/67248H10P 72/0602C23C 16/46G05D 23/1931G05D 23/22H01L 21/67109H10P 72/0434

AI classification

AI hardware0.82
Planning0.34
Machine learning0.01
Natural language0.00
Evolutionary computation0.00
Vision0.00
Speech0.00
Knowledge representation0.00

Ownership

HITACHI KOKUSAI ELECTRIC INC.

assignment · 215640446

Assignors

YAMAGUCHI, HIDETO

On an employer assignment, the assignors are typically the inventors.

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