Patent №
US 8,536,895
Granted
2013-09-17
Filed 2011
Owner
XILINX, INC.
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
13251171
An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated through the interposer; and a second die on the surface of the interposer and coupled to the global signal. The first die and the second die each is configured to implement a same operating state concurrently in response to the global signal.
AI classification
Ownership
XILINX, INC.
assignment · 270030079
Assignors
LU, WEIGUANG, EDWARDS, ERIC E., LAMARCHE, PAUL-HUGO, YOUNG, STEVEN P., GAIDE, BRIAN C., LEYBA, JOE EDDIE, II
On an employer assignment, the assignors are typically the inventors.