METHOD OF MANUFACTURING THROUGH ELECTRODE-ATTACHED GLASS SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
Patent №
US 8,567,052
Granted
2013-10-29
Filed 2011
Owner
SEIKO INSTRUMENTS INC.
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
13135495
A method of manufacturing a through electrode-attached glass substrate includes: forming an effective unit cell by drilling a plurality of through holes in a unit cell with a minimum area acquired by cutting out and dividing plate-shaped glass being configured as the unit cell and distributing dummy unit cells in which the through hole is not formed in an area in which the effective unit cell is formed; inserting electrode members into the through holes; welding the plate-shaped glass and the electrode members by heating the plate-shaped glass at a temperature that is higher than a softening point thereof; and grinding both sides of the plate-shaped glass together with the electrode members so as to expose a plurality of the electrode members to both sides of the plate-shaped glass and configure the plurality of the electrode members as a plurality of through electrodes that are electrically separated from each other.
AI classification
Ownership
SEIKO INSTRUMENTS INC.
assignment · 267080180
Assignors
KAWAI, NOBORU
On an employer assignment, the assignors are typically the inventors.