METHOD OF MANUFACTURING THROUGH ELECTRODE-ATTACHED GLASS SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

Patent №

US 8,567,052

Granted

2013-10-29

Filed 2011

Owner

SEIKO INSTRUMENTS INC.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

13135495

A method of manufacturing a through electrode-attached glass substrate includes: forming an effective unit cell by drilling a plurality of through holes in a unit cell with a minimum area acquired by cutting out and dividing plate-shaped glass being configured as the unit cell and distributing dummy unit cells in which the through hole is not formed in an area in which the effective unit cell is formed; inserting electrode members into the through holes; welding the plate-shaped glass and the electrode members by heating the plate-shaped glass at a temperature that is higher than a softening point thereof; and grinding both sides of the plate-shaped glass together with the electrode members so as to expose a plurality of the electrode members to both sides of the plate-shaped glass and configure the plurality of the electrode members as a plurality of through electrodes that are electrically separated from each other.

PlanningH01L 21/4803H10W 99/00H01L 21/50H01L 23/055H10W 76/153H10W 95/00H01L 2924/0002H03H 9/1021+4 more

AI classification

Planning0.97
Natural language0.01
Vision0.00
Speech0.00
AI hardware0.00
Machine learning0.00
Knowledge representation0.00
Evolutionary computation0.00

Ownership

SEIKO INSTRUMENTS INC.

assignment · 267080180

Assignors

KAWAI, NOBORU

On an employer assignment, the assignors are typically the inventors.

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