DECOMPOSING CUBIC BEZIER SEGMENTS FOR TESSELLATION-FREE STENCIL FILLING

Patent №

US 8,730,253

Granted

2014-05-20

Filed 2011

Owner

NVIDIA CORPORATION

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

13097483

One embodiment of the present invention sets forth a technique for decomposing and filling cubic Bèzier segments of paths without tessellating the paths. Path rendering may be accelerated when a GPU or other processor is configured to perform the decomposition operations. Cubic Bèzier paths are classified and decomposed into simple cubic Bèzier path segments based on the classification. A stencil buffer is then generated that indicates pixels that are inside of the decomposed cubic Bèzier segments. The paths are then filled according to the stencil buffer to produce a filled path.

AI hardwareG06T 15/005G06T 11/203G06T 11/23

AI classification

AI hardware0.65
Knowledge representation0.01
Natural language0.01
Vision0.01
Speech0.00
Evolutionary computation0.00
Machine learning0.00
Planning0.00

Ownership

NVIDIA CORPORATION

assignment · 262070479

Assignors

KILGARD, MARK J.

On an employer assignment, the assignors are typically the inventors.

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