ELECTRONIC DEVICES AND THERMAL IMAGE SENSORS THAT UTILIZE EMBEDDED QUANTUM DOTS

Patent №

US 8,759,936

Granted

2014-06-24

Filed 2011

Owner

SAMSUNG ELECTRONICS CO., LTD.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

13051199

Integrated circuit devices include thermal image sensors that utilize quantum dots therein to provide negative resistance characteristics to at least portions of the sensors. The thermal image sensor may include a sensing unit configured to absorb radiation incident on a first surface thereof and first and second electrodes electrically coupled to the sensing unit. The sensing unit includes a plurality of quantum dots therein, which may extend between the first and second electrodes. These quantum dots may be configured to impart a negative resistance characteristic to the sensing unit. In particular, the sensing unit may include a sensing layer having first and second opposing ends, which are electrically coupled to the first and second electrodes, respectively, and the plurality of quantum dots may be distributed within the sensing layer.

AI hardwareG01J 5/20B82Y 15/00H10F 39/193H10F 77/14

AI classification

AI hardware0.88
Vision0.05
Machine learning0.01
Evolutionary computation0.00
Natural language0.00
Speech0.00
Knowledge representation0.00
Planning0.00

Ownership

SAMSUNG ELECTRONICS CO., LTD.

assignment · 259800627

Assignors

CHO, CHOONG RAE

On an employer assignment, the assignors are typically the inventors.

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