Patent №
US 8,759,936
Granted
2014-06-24
Filed 2011
Owner
SAMSUNG ELECTRONICS CO., LTD.
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
13051199
Integrated circuit devices include thermal image sensors that utilize quantum dots therein to provide negative resistance characteristics to at least portions of the sensors. The thermal image sensor may include a sensing unit configured to absorb radiation incident on a first surface thereof and first and second electrodes electrically coupled to the sensing unit. The sensing unit includes a plurality of quantum dots therein, which may extend between the first and second electrodes. These quantum dots may be configured to impart a negative resistance characteristic to the sensing unit. In particular, the sensing unit may include a sensing layer having first and second opposing ends, which are electrically coupled to the first and second electrodes, respectively, and the plurality of quantum dots may be distributed within the sensing layer.
AI classification
Ownership
SAMSUNG ELECTRONICS CO., LTD.
assignment · 259800627
Assignors
CHO, CHOONG RAE
On an employer assignment, the assignors are typically the inventors.