LIFE PREDICTING METHOD FOR SOLDER JOINT, LIFE PREDICTING APPARATUS FOR SOLDER JOINT AND ELECTRONIC DEVICE
Patent №
US 8,965,712
Granted
2015-02-24
Filed 2011
Owner
KABUSHIKI KAISHA TOSHIBA
Lab
—
AI components
1
evo
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
13051881
A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.
AI classification
Ownership
KABUSHIKI KAISHA TOSHIBA
assignment · 260270925
Assignors
OMORI, TAKAHIRO, HIROHATA, KENJI, MONDA, TOMOKO, HIRAOKA, KATSUAKI, MUKAI, MINORU
On an employer assignment, the assignors are typically the inventors.