Methods and Systems for High Bandwidth Chip-to-Chip Communications Interface

Patent №

US 9,106,220

Granted

2015-08-11

Filed 2014

Owner

KANDOU LABS, S.A.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

14178051

Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.

AI hardwareH03K 19/018521G06F 13/4282H01L 23/5384H03K 3/037H03K 19/017509H04B 1/40H04L 67/12H10W 70/611+11 more

AI classification

AI hardware0.95
Machine learning0.05
Evolutionary computation0.00
Natural language0.00
Vision0.00
Speech0.00
Knowledge representation0.00
Planning0.00

Ownership

KANDOU LABS, S.A.

assignment · 328010029

Assignors

FOX, JOHN, HOLDEN, BRIAN, HUNT, PETER, KEAY, JOHN D, SHOKROLLAHI, AMIN, STEWART, ANDREW KEVIN JOHN, SURACE, GIUSEPPE, ULRICH, ROGER, SIMPSON, RICHARD

On an employer assignment, the assignors are typically the inventors.

© 2026 NYSGPT2525 LLC