CACHE COHERENCY USING DIE-STACKED MEMORY DEVICE WITH LOGIC DIE

Patent №

US 9,170,948

Granted

2015-10-27

Filed 2012

Owner

ADVANCED MICRO DEVICES, INC.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

13726146

A die-stacked memory device implements an integrated coherency manager to offload cache coherency protocol operations for the devices of a processing system. The die-stacked memory device includes a set of one or more stacked memory dies and a set of one or more logic dies. The one or more logic dies implement hardware logic providing a memory interface and the coherency manager. The memory interface operates to perform memory accesses in response to memory access requests from the coherency manager and the one or more external devices. The coherency manager comprises logic to perform coherency operations for shared data stored at the stacked memory dies. Due to the integration of the logic dies and the memory dies, the coherency manager can access shared data stored in the memory dies and perform related coherency operations with higher bandwidth and lower latency and power consumption compared to the external devices.

AI hardwareG06F 12/0828G11C 5/025G11C 8/12G11C 29/12H01L 25/0655H01L 25/18H10W 90/00H01L 25/0657+9 more

AI classification

AI hardware0.50
Knowledge representation0.04
Evolutionary computation0.01
Vision0.00
Planning0.00
Natural language0.00
Machine learning0.00
Speech0.00

Ownership

ADVANCED MICRO DEVICES, INC.

assignment · 295230873

Assignors

LOH, GABRIEL H., BECKMANN, BRADFORD M., HSU, LISA R., IGNATOWSKI, MICHAEL, SCHULTE, MICHAEL J.

On an employer assignment, the assignors are typically the inventors.

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