LASER PROCESSING HEAD AND METHOD FOR PROCESSING A WORKPIECE BY MEANS OF A LASER BEAM

A laser processing head for processing a workpiece by means of laser beam, including a housing through which a beam path for the laser beam is led and which has a focusing optical unit for focusing the laser beam onto a joint of the workpiece to be processed. A light cutting device is fitted to the housing and has a light source for generating a light line on the workpiece. A camera is arranged in an observation beam path in front of the camera such that the camera images the light line at the location to be joined and also the portion. The system also includes an image processor which calculates a minimum distance between the stored target trajectory and the current welding path midpoint.