METHODS FOR INTEGRATED CIRCUIT ANALYSIS

Patent №

US 9,305,124

Granted

2016-04-05

Filed 2012

Owner

LORENTZ SOLUTION, INC.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

13451504

A simulation method for simulating a three-dimensional structure, comprises the steps of: discretizing the three-dimensional structure into two-dimensional (“2-D”) layers; constructing a two-dimensional basis for each of the 2-D layers; and constructing a one-dimensional finite difference basis between the 2-D layers.

AI hardwareG06F 30/23G06F 30/367

AI classification

AI hardware0.74
Planning0.03
Vision0.02
Knowledge representation0.01
Machine learning0.01
Natural language0.00
Evolutionary computation0.00
Speech0.00

Ownership

LORENTZ SOLUTION, INC.

assignment · 280780272

Assignors

HAN, YOUNGAE, ZHAO, JINSONG

On an employer assignment, the assignors are typically the inventors.

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