FINGER BIOMETRIC SENSOR INCLUDING STACKED DIE EACH HAVING A NON-RECTANGULAR SHAPE AND RELATED METHODS

A finger biometric sensor may include first and second integrated circuit (IC) dies arranged in a stacked relation. The first IC die may include a first semiconductor substrate and an array of finger biometric sensing pixels thereon, and the second IC die may include a second semiconductor substrate and processing circuitry thereon coupled to the array of finger biometric sensing pixels. The first and second IC dies may each have respective first and second non-rectangular shapes, such as circular shapes that are coextensive.