DATA CENTER THERMAL MODEL

Patent №

US 9,529,641

Granted

2016-12-27

Filed 2013

Owner

CISCO TECHNOLOGY, INC.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

13975522

A system for managing a data center including a plurality of electronic components, each of which are configured to generate varying levels of heat loads under varying power level utilizations, is disclosed. The system may comprise a data collection module adapted to collect data describing heat loads generated by the plurality of electronic components; an implementation module adapted to implement a model to predict a thermal topology of the data center, wherein the model is based on thermodynamic state equations; and a control module adapted to adjust the heat load of at least one of the plurality of electronic components based on the model.

PlanningG06F 9/5094G01K 7/427G05B 13/048G05D 23/1917G05D 23/193G06F 1/206G06F 30/13G06F 30/20+6 more

AI classification

Planning0.90
Knowledge representation0.01
Machine learning0.01
Evolutionary computation0.01
AI hardware0.00
Natural language0.00
Vision0.00
Speech0.00

Ownership

CISCO TECHNOLOGY, INC.

assignment · 326640851

Assignors

CIVILINI, MASSIMO

On an employer assignment, the assignors are typically the inventors.

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