IMAGE SENSOR WITH ENHANCED QUANTUM EFFICIENCY

Patent №

US 9,565,405

Granted

2017-02-07

Filed 2015

Owner

OMNIVISION TECHNOLOGIES, INC.

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

14612961

A back side illuminated image sensor includes a pixel array including semiconductor material, and image sensor circuitry disposed on a front side of the semiconductor material to control operation of the pixel array. A first pixel includes a first doped region disposed proximate to a back side of the semiconductor material and extends into the semiconductor material a first depth to reach the image sensor circuitry. A second pixel with a second doped region is disposed proximate to the back side of the semiconductor material and extends into the semiconductor material a second depth which is less than the first depth. A third doped region is disposed between the second doped region and the image sensor circuitry on the front side of the semiconductor material. The third doped region is electrically isolated from the first doped region and the second doped region.

VisionH10F 39/199H04N 25/70H04N 25/778H10F 39/1825H10F 39/813H10F 39/8063

AI classification

Vision0.93
AI hardware0.04
Knowledge representation0.01
Natural language0.00
Planning0.00
Evolutionary computation0.00
Machine learning0.00
Speech0.00

Ownership

OMNIVISION TECHNOLOGIES, INC.

assignment · 348790532

Assignors

CHEN, GANG, MASSETTI, DOMINIC, HSIUNG, CHIH-WEI, KUMAR, ARVIND, ZHENG, YUANWEI, MAO, DULI, TAI, DYSON H.

On an employer assignment, the assignors are typically the inventors.

© 2026 NYSGPT2525 LLC