Patent №
US 9,565,405
Granted
2017-02-07
Filed 2015
Owner
OMNIVISION TECHNOLOGIES, INC.
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
14612961
A back side illuminated image sensor includes a pixel array including semiconductor material, and image sensor circuitry disposed on a front side of the semiconductor material to control operation of the pixel array. A first pixel includes a first doped region disposed proximate to a back side of the semiconductor material and extends into the semiconductor material a first depth to reach the image sensor circuitry. A second pixel with a second doped region is disposed proximate to the back side of the semiconductor material and extends into the semiconductor material a second depth which is less than the first depth. A third doped region is disposed between the second doped region and the image sensor circuitry on the front side of the semiconductor material. The third doped region is electrically isolated from the first doped region and the second doped region.
AI classification
Ownership
OMNIVISION TECHNOLOGIES, INC.
assignment · 348790532
Assignors
CHEN, GANG, MASSETTI, DOMINIC, HSIUNG, CHIH-WEI, KUMAR, ARVIND, ZHENG, YUANWEI, MAO, DULI, TAI, DYSON H.
On an employer assignment, the assignors are typically the inventors.