THERMAL FLUID MODELING WITH PHYSICAL NETWORK APPROACH AND USING CONDUCTION AND CONVECTION
Patent №
US 9,568,258
Granted
2017-02-14
Filed 2012
Owner
THE MATHWORKS, INC.
Lab
—
AI components
3
ml · planning · hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
13624392
A device receives information associated with a physical network, and creates a thermal fluid model, based on the information and with a technical computing environment (TCE), the thermal fluid model including at least a first block, a second block, and a node connecting the first block and the second block. The device calculates a first convection power flux for the first block and a second convection power flux for the second block, and calculates a first conduction power flux for the first block and a second conduction power flux for the second block. The device adds the first convection power flux and the first conduction power flux to determine a first power flux, and adds the second convection power flux and the second conduction power flux to determine a second power flux. The device outputs the first power flux and the second power flux.
AI classification
Ownership
THE MATHWORKS, INC.
assignment · 290050796
Assignors
COLAS, DORIAN, WENDLANDT, JEFFREY M.
On an employer assignment, the assignors are typically the inventors.