ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A MULTI-PROCESSOR SYSTEM ON A CHIP

Patent №

US 9,582,012

Granted

2017-02-28

Filed 2014

Owner

QUALCOMM INCORPORATED

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

14280629

Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

AI hardwareG05D 23/1917G05B 15/02G06F 1/203G06F 1/206G06F 1/26G06F 1/3206G06F 1/324G06F 1/3296+6 more

AI classification

AI hardware1.00
Natural language0.00
Speech0.00
Machine learning0.00
Knowledge representation0.00
Evolutionary computation0.00
Planning0.00
Vision0.00

Ownership

QUALCOMM INCORPORATED

assignment · 330630106

Assignors

PARK, HEE JUN, KANG, YOUNG HOON, ALTON, RONALD FRANK, MEDRANO, CHRISTOPHER LEE, ANDERSON, JON JAMES

On an employer assignment, the assignors are typically the inventors.

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