Patent №
US 9,595,481
Granted
2017-03-14
Filed 2014
Owner
KLA-TENCOR CORPORATION
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
14464640
Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical models of semiconductor structures capable of accurate characterization of defects in high-K dielectric layers and embedded nanostructures are presented. In one example, the optical dispersion model includes a continuous Cody-Lorentz model having continuous first derivatives that is sensitive to a band gap of a layer of the unfinished, multi-layer semiconductor wafer. These models quickly and accurately represent experimental results in a physically meaningful manner. The model parameter values can be subsequently used to gain insight and control over a manufacturing process.
AI classification
Ownership
KLA-TENCOR CORPORATION
assignment · 338720524
Assignors
MOLKOVA, NATALIA, POSLAVSKY, LEONID, DI, MING, ZHAO, QIANG, HU, DAWEI
On an employer assignment, the assignors are typically the inventors.