SOLDER MATERIAL AND CONNECTED STRUCTURE

Patent №

US 9,656,351

Granted

2017-05-23

Filed 2016

Owner

HIROSHIMA UNIVERSITY

Lab

AI components

1

evo

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

15101306

Provided is a solder material that has a high melting point and exhibits superior mechanical characteristics, and therefore can form a connecting portion with high heat-resistant reliability.

Evolutionary computationB23K 35/264B23K 35/0244B23K 35/025B23K 35/26C22C 12/00H01L 24/29H05K 3/3465H10W 42/121+22 more

AI classification

Evolutionary computation0.51
Natural language0.02
Machine learning0.02
Speech0.00
Vision0.00
AI hardware0.00
Planning0.00
Knowledge representation0.00

Ownership

HIROSHIMA UNIVERSITY

assignment · 387940454

Assignors

MATSUGI, KAZUHIRO, SUETSUGU, KENICHIRO

On an employer assignment, the assignors are typically the inventors.

From the same owner

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