Apparatus and Methods for Scalable Photonic Packet Architectures Using PIC Switches

Patent №

US 9,658,403

Granted

2017-05-23

Filed 2015

Owner

HUAWEI TECHNOLOGIES CO., LTD.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

14695970

Embodiments are provided for scalable photonic packet fabric architectures using photonic integrated circuit switches. The architectures use compact size silicon photonic circuits that can be arranged in a combined centralized and distributed manner. In an embodiment, an optical switch structure comprises a plurality of core photonic based switches and a plurality of photonic interface units (PIUs) optically coupled to the core photonic based switches and to a plurality of groups of top-of-rack switches (TORs). Each PIU comprises a N×N silicon photonic (SiP) switch optically coupled to a group of TORs associated with the PIU from the groups of TORs, where N is a number of the TORs in each group. The PIU also comprises a plurality of 1×P SiP switches coupled to the group of TORs associated with the PIU and to the core photonic based switches, where P is a number of the core photonic based switches.

AI hardwareG02B 6/3546G02B 6/3548G02B 6/3556G02B 6/3558H04Q 11/0003H04Q 11/0005H04Q 2011/0024H04Q 2011/0039+3 more

AI classification

AI hardware1.00
Machine learning0.01
Planning0.00
Vision0.00
Speech0.00
Evolutionary computation0.00
Knowledge representation0.00
Natural language0.00

Ownership

HUAWEI TECHNOLOGIES CO., LTD.

assignment · 357630852

Assignors

MEHRVAR, HAMID, MA, HUIXIAO, BERNIER, ERIC

On an employer assignment, the assignors are typically the inventors.

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