Systems and Methods for Wafer Surface Feature Detection and Quantification

Patent №

US 9,702,829

Granted

2017-07-11

Filed 2014

Owner

KLA-TENCOR CORPORATION

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

14246895

Interferometer systems and methods for providing improved defect detection and quantification are disclosed. The systems and methods in accordance with the present disclosure may detect surface defects on patterned or bare wafer surfaces and subsequently quantify them. In certain embodiments in accordance with the present disclosure, amplitude maps of the wafer surfaces are obtained and are utilized in addition/alternative to phase maps for wafer surface feature detection. Furthermore, local one-dimensional and/or two-dimensional unwrapping techniques are also disclosed and are utilized in certain embodiments in accordance with the present disclosure to provide height and depth information of the detected defects, further improving the detection capabilities of the measurement systems.

VisionG01N 21/9501G01N 21/956G01B 11/30G01B 11/303G01B 11/306G01B 2210/56

AI classification

Vision1.00
Planning0.00
Evolutionary computation0.00
Natural language0.00
Speech0.00
Machine learning0.00
Knowledge representation0.00
AI hardware0.00

Ownership

KLA-TENCOR CORPORATION

assignment · 328520200

Assignors

CHEN, HAIGUANG, SINHA, JAYDEEP, KAMENSKY, SERGEY, CHAVEZ, ENRIQUE, TANG, SHOUHONG, PLEMMONS, MARK

On an employer assignment, the assignors are typically the inventors.

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