METHOD OF MEASURING A SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
Patent №
US 9,716,047
Granted
2017-07-25
Filed 2016
Owner
SAMSUNG ELECTRONICS CO., LTD
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
15218026
A method for measuring a substrate is provided. The method comprises irradiating a measurement beam into a site box of an identifiable pattern of a substrate, detecting a center position of the irradiated measurement beam, calculating an amount of shift of the center position of the measurement beam from the center position of the site box, and correcting the center position of the measurement beam to the center position of the site box by compensating the calculated amount of shift.
AI classification
Ownership
SAMSUNG ELECTRONICS CO., LTD
assignment · 397780676
Assignors
JHON, CHOL-MIN, PARK, SEOK, JUNG, HO-HYUNG, KIM, YANG-KYU, LEE, JAE-YOUNG
On an employer assignment, the assignors are typically the inventors.