Patent №
US 9,865,548
Granted
2018-01-09
Filed 2016
Owner
INVENSAS CORPORATION
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
15158963
An interconnect (124) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member (130) which is conductive and/or is coated with a conductive material (144). Such interconnects replace metal bond wires in some embodiments. Other features are also provided.
AI hardwareH01L 23/49811H10W 20/4473H01L 24/96H01L 25/0652H10W 20/023H10W 20/031H10W 20/062H10W 20/42+27 more
AI classification
AI hardware0.86
Natural language0.04
Machine learning0.03
Knowledge representation0.00
Speech0.00
Vision0.00
Planning0.00
Evolutionary computation0.00
Ownership
INVENSAS CORPORATION
assignment · 386470946
Assignors
UZOH, CYPRIAN EMEKA, KATKAR, RAJESH, WOYCHIK, CHARLES G., GAO, GUILIAN, SITARAM, ARKALGUD R.
On an employer assignment, the assignors are typically the inventors.
From the same owner
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