ULTRASONIC THICK SLICE IMAGE FORMING VIA PARALLEL MULTIPLE SCANLINE ACQUISITION

Patent №

US 9,880,271

Granted

2018-01-30

Filed 2009

Owner

KONINKLIJKE PHILIPS ELECTRONICS N.V.

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

12594885

An ultrasonic diagnostic imaging system scans a plurality of planar slices in a volumetric region which are parallel to each other. Following detection of the image data of the slices the slice data is combined by projecting the data in the elevation dimension to produce a “thick slice” image. Combining may be by means of an averaging or maximum intensity detection or weighting process or by raycasting in the elevation dimension in a volumetric rendering process. Thick slice images are displayed at a high frame rate of display by combining a newly acquired slice with slices previously acquired from different elevational planes which were used in a previous combination. A new thick slice image may be produced each time at least one of the slice images is updated by a newly acquired slice. Frame rate is further improved by multiline acquisition of the slices.

VisionG01S 7/52085G01S 7/52095G01S 15/8925G01S 15/8993A61B 8/483G01S 7/52065G01S 15/8918G01S 15/8934

AI classification

Vision0.97
Natural language0.00
Evolutionary computation0.00
Machine learning0.00
Planning0.00
AI hardware0.00
Speech0.00
Knowledge representation0.00

Ownership

KONINKLIJKE PHILIPS ELECTRONICS N.V.

assignment · 233320751

Assignors

THIELE, KARL

On an employer assignment, the assignors are typically the inventors.

From the same owner

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