HBM WITH IN-MEMORY CACHE MANAGER

Patent №

US 10,180,906

Granted

2019-01-15

Filed 2016

Owner

SAMSUNG ELECTRONICS CO., LTD

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

15272339

A system and method for using high bandwidth memory as cache memory. A high bandwidth memory may include a logic die, and, stacked on the logic die, a plurality of dynamic read-only memory dies. The logic die may include a cache manager, that may interface to external systems through an external interface conforming to the JESD235A standard, and that may include an address translator, a command translator, and a tag comparator. The address translator may translate each physical address received through the external interface into a tag value, a tag address in the stack of memory dies, and a data address in the stack of memory dies. The tag comparator may determine whether a cache hit or cache miss has occurred, according to whether the tag value generated by the address translator matches the tag value stored at the tag address.

AI hardwareG06F 12/0862G06F 12/0893G06F 2212/1024G06F 2212/6028G11C 2207/107G11C 2211/5643Y02D 10/00

AI classification

AI hardware0.89
Evolutionary computation0.01
Natural language0.00
Knowledge representation0.00
Vision0.00
Machine learning0.00
Speech0.00
Planning0.00

Ownership

SAMSUNG ELECTRONICS CO., LTD

assignment · 401550866

Assignors

STOCKSDALE, TYLER, CHANG, MU-TIEN, ZHENG, HONGZHONG

On an employer assignment, the assignors are typically the inventors.

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