Process for Analyzing Printed Circuit Board and Packaging Manufacturing Design Rules

Patent №

US 10,691,868

Granted

2020-06-23

Filed 2018

Owner

CADENCE DESIGN SYSTEMS, INC.

Lab

AI components

2

kr · planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16126734

The present disclosure relates to a system and method for use in an electronic circuit design. Embodiments may include an electronic computer aided design (“CAD”) system configured to receive one or more design rules and to receive one or more manufacturing rules. The CAD system may be further configured to analyze design database objects from the electronic design with respect to the manufacturing rules. The CAD system may generate a manufacturing output file, based upon, at least in part, the analyzing. Embodiments may also include a signoff computer aided manufacturing (“CAM”) station configured to receive the manufacturing output file. The CAM station may be configured to attempt to validate the manufacturing output file.

Knowledge representationPlanningG06F 30/398G05B 19/4097G06F 30/36G05B 2219/35032G06F 2113/18G06F 2115/12Y02P 80/40Y02P 90/02

AI classification

Planning0.99
Knowledge representation0.70
AI hardware0.15
Natural language0.02
Machine learning0.01
Vision0.00
Evolutionary computation0.00
Speech0.00

Ownership

CADENCE DESIGN SYSTEMS, INC.

assignment · 468310215

Assignors

LAWSON, RANDALL SCOTT, BHATTACHARYYA, UTPAL, ACHESON, EDWARD B., ROESLER, ROBERT

On an employer assignment, the assignors are typically the inventors.

From the same owner

© 2026 NYSGPT2525 LLC