SEMICONDUCTOR MODULE

Patent №

US 10,692,810

Granted

2020-06-23

Filed 2017

Owner

SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.

Lab

AI components

1

nlp

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

15511512

A semiconductor module includes a first electronic device in which one terminal is connected to a first wiring line, the other terminal is connected to a second wiring line, and a first device current flows in a first current direction from the first wiring line to the second wiring line, and a second electronic device in which one terminal is connected to a third wiring line, the other terminal is connected to a fourth wiring line, and a second device current flows in a second current direction from the third wiring line to the fourth wiring line, the first electronic device and the second electronic device being disposed such that at least part of a first magnetic flux generated by the first device current flowing in the first current direction cancels at least part of a second magnetic flux generated by the second device current.

Natural languageH01L 25/071H10W 20/497H10W 90/00H01L 23/5385H01L 2224/0603H01L 2224/40225H01L 2224/4903H02M 7/003+2 more

AI classification

Natural language0.73
Planning0.00
AI hardware0.00
Evolutionary computation0.00
Vision0.00
Knowledge representation0.00
Speech0.00
Machine learning0.00

Ownership

SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.

assignment · 415850001

Assignors

IKEDA, KOSUKE, SUZUKI, KENICHI

On an employer assignment, the assignors are typically the inventors.

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