Patent №
US 10,692,876
Granted
2020-06-23
Filed 2019
Owner
TOSHIBA MEMORY CORPORATION
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16275260
A semiconductor device includes a first film that includes first electrode layers separated from each other in a first direction and extending in second and third directions, first columnar portions in the first film, that include a charge storage layer and a first semiconductor layer, and extend in the first direction, a second film on the first film and including second electrode layers separated from each other in the first direction and extending in second and third directions, second columnar portions in the second film and on the first columnar portions, that include a second semiconductor layer and extend in the first direction, and first insulating films separated from the second columnar portions in the third direction in the second film and extending in first and second directions. The first columnar portions form a square or rectangular lattice pattern below the first insulating films and a triangular lattice pattern elsewhere.
AI classification
Ownership
TOSHIBA MEMORY CORPORATION
assignment · 483250115
Assignors
OKAWA, TAKAMASA
On an employer assignment, the assignors are typically the inventors.