SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Patent №

US 10,692,876

Granted

2020-06-23

Filed 2019

Owner

TOSHIBA MEMORY CORPORATION

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16275260

A semiconductor device includes a first film that includes first electrode layers separated from each other in a first direction and extending in second and third directions, first columnar portions in the first film, that include a charge storage layer and a first semiconductor layer, and extend in the first direction, a second film on the first film and including second electrode layers separated from each other in the first direction and extending in second and third directions, second columnar portions in the second film and on the first columnar portions, that include a second semiconductor layer and extend in the first direction, and first insulating films separated from the second columnar portions in the third direction in the second film and extending in first and second directions. The first columnar portions form a square or rectangular lattice pattern below the first insulating films and a triangular lattice pattern elsewhere.

AI hardwareH10B 43/10H10B 43/27H10B 41/30H10B 69/00H10D 64/037

AI classification

AI hardware0.73
Knowledge representation0.18
Natural language0.01
Machine learning0.01
Vision0.00
Evolutionary computation0.00
Speech0.00
Planning0.00

Ownership

TOSHIBA MEMORY CORPORATION

assignment · 483250115

Assignors

OKAWA, TAKAMASA

On an employer assignment, the assignors are typically the inventors.

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