Patent №
US 10,692,874
Granted
2020-06-23
Filed 2018
Owner
HARARI, ELI
+1 more
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16006573
A memory structure formed above a semiconductor substrate includes two or more modules each formed on top of each other separated by a layer of global interconnect conductors. Each memory module may include a 3-dimensional array of memory transistors organized as NOR array strings. Each 3-dimensional array of memory transistors is provided vertical local word lines as gate electrodes to the memory transistors. These vertical local word lines are connected by the layers of global interconnect conductors below and above the 3-dimensional array of memory transistors to circuitry formed in the semiconductor substrate.
AI classification
Ownership
HARARI, ELI
assignment · 460610761
SUNRISE MEMORY CORPORATION
assignment · 460610862