3-Dimensional NOR String Arrays in Segmented Stacks

Patent №

US 10,692,874

Granted

2020-06-23

Filed 2018

Owner

HARARI, ELI

+1 more

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16006573

A memory structure formed above a semiconductor substrate includes two or more modules each formed on top of each other separated by a layer of global interconnect conductors. Each memory module may include a 3-dimensional array of memory transistors organized as NOR array strings. Each 3-dimensional array of memory transistors is provided vertical local word lines as gate electrodes to the memory transistors. These vertical local word lines are connected by the layers of global interconnect conductors below and above the 3-dimensional array of memory transistors to circuitry formed in the semiconductor substrate.

AI hardwareH10B 69/00B01J 37/16C01G 3/00C07C 1/12C22B 15/00C25B 3/25C25B 11/051C25B 11/075+11 more

AI classification

AI hardware0.78
Natural language0.03
Machine learning0.01
Knowledge representation0.00
Vision0.00
Speech0.00
Evolutionary computation0.00
Planning0.00

Ownership

HARARI, ELI

assignment · 460610761

SUNRISE MEMORY CORPORATION

assignment · 460610862

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