Patent US 11,328,208

Techniques in advanced deep learning provide improvements in one or more of cost, accuracy, performance, and energy efficiency. The deep learning accelerator is implemented at least in part via wafer-scale integration. The wafer comprises a plurality of processor elements, each augmented with redundancy-enabling couplings. The redundancy-enabling couplings enable using redundant ones of the processor elements to replace defective ones of the processor elements. Defect information gathered at wafer test and/or in-situ, such as in a datacenter, is used to determine configuration information for the redundancy-enabling couplings.