SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Patent №

US 11,637,240

Granted

2023-04-25

Filed 2020

Owner

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16844875

A semiconductor memory structure includes a memory cell, an encapsulation layer over a sidewall of the memory cell, and a nucleation layer between the sidewall of the memory cell and the encapsulation layer. The memory cell includes a top electrode, a bottom electrode and a data-storage element sandwiched between the bottom electrode and the top electrode. The nucleation layer includes metal oxide.

AI hardwareH10N 70/841G11C 13/0007H10B 63/30H10B 63/80H10N 70/011H10N 70/063H10N 70/231H10N 70/245+6 more

AI classification

AI hardware0.99
Natural language0.01
Planning0.00
Machine learning0.00
Speech0.00
Evolutionary computation0.00
Knowledge representation0.00
Vision0.00

Ownership

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

assignment · 523600408

Assignors

LIN, HSING-LIEN, SUNG, FU-TING, YANG, CHING JU, WU, CHII-MING

On an employer assignment, the assignors are typically the inventors.

© 2026 NYSGPT2525 LLC