Patent №
US 11,637,240
Granted
2023-04-25
Filed 2020
Owner
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16844875
A semiconductor memory structure includes a memory cell, an encapsulation layer over a sidewall of the memory cell, and a nucleation layer between the sidewall of the memory cell and the encapsulation layer. The memory cell includes a top electrode, a bottom electrode and a data-storage element sandwiched between the bottom electrode and the top electrode. The nucleation layer includes metal oxide.
AI classification
Ownership
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
assignment · 523600408
Assignors
LIN, HSING-LIEN, SUNG, FU-TING, YANG, CHING JU, WU, CHII-MING
On an employer assignment, the assignors are typically the inventors.