SYSTEM AND METHOD FOR DYNAMICALLY ADJUSTING THIN-FILM DEPOSITION PARAMETERS

A thin-film deposition and method deposits thin films on semiconductor wafers. The thin-film deposition utilizes an analysis model that dynamically selects process conditions for a next deposition process by receiving static process conditions and target thin-film data. The analysis model identifies dynamic process conditions data that, together with the static process conditions data, result in predicted thin-film data that matches the target thin-film data. The deposition method then uses the static and dynamic process conditions data for the next thin-film deposition process.