METHOD FOR PROCESSING SEMICONDUCTOR WAFER

Methods for processing a semiconductor wafer are provided. A plurality of patches are extracted from the query image related to the semiconductor wafer. The patches are encoded with a set of weightings to obtain an encoding matrix. The database is searched based on the encoding matrix to retrieve the images corresponding to the query image. The retrieved images is used to inspect of defects of the semiconductor wafer, so as to generate an inspection result. A semiconductor process is performed on the semiconductor wafer when the inspection result is normal.