DEVICE AND METHOD FOR ACCURATE ETCHING AND REMOVAL OF THIN FILM

Patent №

US 5,282,925

Granted

1994-02-01

Filed 1992

Owner

INTERNATIONAL BUSINESS MACHINES CORP.

+1 more

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

07973380

New device and method are described for accurate etching and removal of thin layer by controlling the surface residence time, thickness and composition of reactant containing film. Etching of silicon dioxide at low pressure using a quartz crystal microbalance is illustrated. Usefulness of the invention in the manufacture of microelectronic devices is shown.

AI hardwareH01L 21/67069H10P 72/0421H01L 21/31116H10P 50/283

AI classification

AI hardware0.79
Machine learning0.01
Vision0.00
Speech0.00
Evolutionary computation0.00
Natural language0.00
Knowledge representation0.00
Planning0.00

Ownership

INTERNATIONAL BUSINESS MACHINES CORP.

assignment · 63740022

TOKYO ELECTRON LIMITED

assignment · 211380886

Assignors

JENG, SHWU-JEN, NATZLE, WESLEY C., YU, CHIENFAN

On an employer assignment, the assignors are typically the inventors.

From the same owner

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