A NON-HYPERCUBE INTERCONNECTION SUBSYSTEM HAVING A SUBSET OF NODES INTERCONNECTED USING POLYGONAL TOPOLOGY AND OTHER NODES CONNECT TO THE NODES IN THE SUBSET

Patent №

US 5,859,983

Granted

1999-01-12

Filed 1996

Owner

SUN MICROSYSTEMS, INC.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

08675629

Interconnection subsystems having diverse topologies are disclosed for interconnecting small numbers of nodes having a predetermined maximum degree in a multiprocessor computer system. The interconnection subsystems are generally classified into three diverse classes of topologies, including a "polygonal" class, a "ladder" class and a "tiled" class. In topologies of the polygonal class, a majority of the nodes in the multiprocessor computer system are connected in a ring and the remaining nodes are connected to the nodes in the ring, and in some cases also to each other. In topologies of the ladder class, the nodes are interconnected in a "ladder" topology comprising a series of nodes connected in a ring, the ring corresponding to one standard of a ladder topology folded on itself. Each node in the ring is connected to another node in a second series, effectively forming rungs of the ladder topology. The nodes in the second series can be interconnected in a variety of arrangements, including a second ring, thereby effectively providing a second standard of the ladder topology. In topologies of the tiled class, the nodes are interconnected in tiled mesh-like topologies with six nodes for each mesh element, thereby providing a hexagonal or elongated "brick-like" non"square" rectangular arrangement. Edges of the mesh are preferably connected together to provide a folded toroid-like arrangement.

AI hardwareH04L 41/12G06F 15/17343G06F 15/8007

AI classification

AI hardware0.95
Machine learning0.12
Natural language0.03
Knowledge representation0.01
Vision0.00
Evolutionary computation0.00
Speech0.00
Planning0.00

Ownership

SUN MICROSYSTEMS, INC.

assignment · 81650411

Assignors

HELLER, STEVEN K., STEELE, GUY L. JR.

On an employer assignment, the assignors are typically the inventors.

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