Patent №
US 6,013,533
Granted
2000-01-11
Filed 1997
Owner
LSI LOGIC CORORATION
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
08924187
A method of sorting dies found on wafers is disclosed. Each wafer is part of a set of wafers and the sorting rejects some of the dies. The method first selects an acceptable deviation within an abstract distribution. A respective test parameter is measured and recorded for each die in the set of wafers, and a distribution of the test parameter across the set of wafers is calculated. Based on this distribution and the acceptable deviation, a test parameter limit is set and any dies having a test parameter value greater than the limit are rejected.
AI classification
Ownership
LSI LOGIC CORORATION
assignment · 87020534
Assignors
SUGASAWARA, EMERY OSAMU, KELLER, SCOTT FRANKLIN
On an employer assignment, the assignors are typically the inventors.