WAFER MAP ANALYSIS AID SYSTEM, WAFER MAP ANALYZING METHOD AND WAFER PROCESSING METHOD
Patent №
US 6,128,403
Granted
2000-10-03
Filed 1998
Owner
MITSUBISHI DENKI KABUSHIKI KAISHA
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
09026184
In order to solve various problems of a wafer, two-dimensional analysis using a wafer map is aided. An image of the wafer map is classified and displayed on a screen for each item such as a manufacturing step, a device and inspection. A trend chart is also attached in addition to the image of the wafer map.
AI classification
Vision0.63
Planning0.47
Machine learning0.02
AI hardware0.01
Evolutionary computation0.00
Natural language0.00
Knowledge representation0.00
Speech0.00
Ownership
MITSUBISHI DENKI KABUSHIKI KAISHA
assignment · 93090322
Assignors
OZAKI, HIROJI
On an employer assignment, the assignors are typically the inventors.
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