MECHANISM AND METHOD FOR DISTRIBUTING ISUP STACKS OVER MULTIPLE LOOSELY COUPLED PROCESSORS

Patent №

US 6,507,649

Granted

2003-01-14

Filed 1998

Owner

ERICSSON INC.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

09216079

A thin ISUP layer (100) for internetworking an SS7 gateway and distributed ISUPs (90) residing on separate processors suitable for use in an SS7 network (50). The thin-ISUP layer (100) defines an operations/management module that controls circuit signaling functions between an SS7 gateway and the distributed ISUPs (90). A set of ISUP messaging functions are provided to control the sequencing of messages for distribution among the processors. Connection supervision is provided to maintain the connections between the processors. The thin ISUP layer (100) can be implemented between the MPT layer (84, 86, 88) and an ISUP layer (90) of distributed processors in the network (50).

AI hardwareH04M 7/066H04Q 3/0025H04Q 11/0435

AI classification

AI hardware1.00
Machine learning0.00
Planning0.00
Vision0.00
Evolutionary computation0.00
Speech0.00
Natural language0.00
Knowledge representation0.00

Ownership

ERICSSON INC.

assignment · 96730914

Assignors

TOVANDER, LARS A.

On an employer assignment, the assignors are typically the inventors.

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