METHOD FOR PROVIDING DISTRIBUTED MATERISL MANAGEMENT AND FLOW CONTROL IN AN INTEGRANATED CIRCUIT FACTORY

Patent №

US 6,580,967

Granted

2003-06-17

Filed 2001

Owner

APPLIED MATERIALS, INC.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

09893037

A method and apparatus for providing distributed material management and flow control in an integrated circuit (IC) factory. The IC factory comprises a factory stocker, a plurality of process bays and a factory transport agent for moving wafer cassettes between the bay and the stocker. Each of the bays comprises a bay stocker, a plurality of tools, a mini-stocker and a bay transport agent for moving wafers amongst the bay components. The apparatus uses partitioned stockers to facilitate deadlock avoidance or deadlock resolution. Additionally, various algorithms are used to detect wafer cassette movement situations where deadlocks may result from a wafer cassette movement within a bay and for resolving deadlocks when they occur.

PlanningH01L 21/67276H10P 72/0612G05B 19/41865G05B 2219/31378G05B 2219/45031Y02P 90/02Y02P 90/80Y10S 414/14

AI classification

Planning0.98
AI hardware0.03
Knowledge representation0.00
Vision0.00
Speech0.00
Natural language0.00
Evolutionary computation0.00
Machine learning0.00

Ownership

APPLIED MATERIALS, INC.

assignment · 119500405

Assignors

JEVTIC, DUSAN, SUNKARA, RAJA S.

On an employer assignment, the assignors are typically the inventors.

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