METHOD TO PREDICT DIELECTRIC FILM PROPERTIES USING CHEMICAL BONDING MEASUREMENTS AS INPUT TO COMPUTER MODELING
Patent №
US 6,836,693
Granted
2004-12-28
Filed 2000
Owner
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Lab
—
AI components
3
ml · planning · hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
09624023
A new computer based method is provided for the evaluation of dielectric film properties. These properties are for a given dielectric derived from measurements of the chemical bonding of that dielectric. Previously collected reference data are maintained in a reference data base from where data are extracted and used as input to mathematical modeling software that predicts thin film properties. The output of these prediction algorithms is used, together with chemical bonding measurements of the dielectric that is being investigated, as input to a program that computers the dielectric properties of the dielectric.
AI classification
Ownership
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
assignment · 111190906
Assignors
CHIOU, HUNG-WEN
On an employer assignment, the assignors are typically the inventors.