METHOD FOR INSPECTING DEFECTS AND AN APPARATUS FOR THE SAME

The present invention provides a highly sensitive inspection technology that prevents false detections. The present invention includes means for detecting an image of an entire chip. Using this image, inspection regions are defined based on criticality. Detection sensitivities can be set for each of these inspection sensitivities. Alternatively, false detections can be eliminated in post-inspection processing by recording characteristic values used to evaluate defects, e.g., concentration differences, in the inspection results. Furthermore, by providing a system that allows sharing of inspection conditions and the like needed by multiple inspection devices, the time required for determining inspection conditions can be shortened and stability and reliability can be monitored.