Patent US 6,944,578

Patent №

US 6,944,578

Granted

Owner

Lab

AI components

1

planning

Assignment

None on record

Dataset

AIPD

2023_r1 edition

Application

10868411

A method uses three dimensional feature metrology for implementation of critical image control and feedback of lithographic focus and x/y tilt. The method is for measuring 3 dimensional profile changes in a photo sensitive film and feeding back compensatory exposure tool focus corrections to maintain a stable lithographic process. The measured focus change from the optimal tool focus offset is monitored directly on the critical product images for both contact hole and line images. Z Focus corrections and x/y tilt corrections are fed back independently of dose to maintain critical dimension (CD) control. Additionally, the method can be used to diagnose problems with the focusing system by measuring the relationship between line edge width and barometric pressure.

PlanningG03F 7/70625G03F 7/70641

AI classification

Planning0.91
Natural language0.00
Knowledge representation0.00
Machine learning0.00
Evolutionary computation0.00
Speech0.00
AI hardware0.00
Vision0.00
© 2026 NYSGPT2525 LLC