METHOD AND SYSTEM FOR ANALYZING WAFER YIELD AGAINST USES OF A SEMICONDUCTOR TOOL

A method for analyzing wafer yield against uses of a semiconductor tool. A yield database includes at least yield data consisting of a wafer identity number, wafer yield, and a serial number of the semiconductor tool. A processing device generates a box plot chart according to the yield data. Thereafter, the processing device generates a P-value statistical chart according to the yield data. Then, the processing device generates a ratio limit chart according to the yield data. The processing device divides a high yield percentage value into a low yield percentage value to generate a deviant quotient. Thereafter, the processing device analyzes influence of the semiconductor equipment on the wafer yield according to the deviation limit and the deviant quotient. Finally, the semiconductor equipment is adjusted according to the box plot chart, the P-value statistical chart, and the ratio limit chart.